13th Int'l Symposium on Quality Electronic Design

نویسندگان

  • Tadashi Yasufuku
  • Koji Hirairi
  • Yu Pu
  • Yun Fei Zheng
  • Ryo Takahashi
  • Masato Sasaki
  • Hiroshi Fuketa
  • Atsushi Muramatsu
  • Masahiro Nomura
  • Hirofumi Shinohara
  • Makoto Takamiya
  • Takayasu Sakurai
چکیده

A post-fabrication dual supply voltage (VDD) control (PDVC) of multiple voltage domains is proposed for a minimum operating voltage (VDDmin)-limited ultra low voltage logic circuits. PDVC effectively reduces an average VDD below VDDmin, thereby reducing the power consumption of logic circuits. PDVC is applied to a DES CODEC’s circuit fabricated in 65nm CMOS. The layout of DES CODEC’s is divided into 64 VDD domains and each domain size is 54m x 63.2m. High VDD (VDDH) or low VDD (VDDL) is applied to each domain and the selection of VDD’s is performed based on multiple built-in self tests. VDDH is selected in VDDmin-critical domains, while VDDL is selected in VDDmin-non-critical domains. A maximum 24% power reduction was measured with the proposed PDVC at 300kHz, VDDH =437mV, and VDDL=397mV.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

13th Int'l Symposium on Quality Electronic Design

Bias temperature instability (among other problems) is a key reliability issue with nanoscale CMOS transistors. Especially in sensitive circuits such as sense amplifiers of SRAM arrays, transistor aging may significantly increase the probability of failure. By analyzing the Current Based Sense Amplifier circuit and Voltage-Latched Sense Amplifier circuit through HSPICE simulations, we observe t...

متن کامل

13th Int'l Symposium on Quality Electronic Design

Three dimensional integrated circuits (3D ICs) built with through-silicon vias (TSVs) have smaller footprint area, shorter wirelength, and better performance than 2D ICs. However, the quality of 3D ICs is strongly dependent on TSV dimensions and parasitics. Using large TSVs may cause silicon area overhead and reduce the amount of wirelength reduction in 3D ICs. In addition, non-negligible TSV p...

متن کامل

13th Int'l Symposium on Quality Electronic Design

The Network-on-Chip (NoC) is an enabling technology to integrate large numbers of embedded cores on a single die. Traditional multi-core designs based on the NoC paradigm suffer from high latency and power dissipation due to the inherent multi-hop nature of communication. The performance of NoC fabrics can be significantly enhanced by introducing long-range, low power, and high-bandwidth single...

متن کامل

13th Int'l Symposium on Quality Electronic Design

In modern VLSI circuits, a large number of clock buffers are inserted in clock distribution networks, which are significantly affected by process and power supply noise variations. The combined effect of process variations and power supply noise on clock skew and jitter is investigated in this paper. A statistical model of skitter, which consists of skew and jitter, is proposed. Clock paths wit...

متن کامل

13th Int'l Symposium on Quality Electronic Design

Experimental results of an active filter based onchip hybrid voltage converter are described in this paper. The area of the voltage converter is significantly less than the area of a conventional passive filter based DC-DC voltage converter or a low-dropout (LDO) regulator. Hence, the proposed circuit is appropriate for point-of-load voltage regulation for the noise sensitive portions of an int...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2012